Mechanical/Packaging Engineer; Microwave Modules - Boston
Location: Boston Massachusetts
Description: Advanced Technology Search is looking of Mechanical/Packaging Engineer; Microwave Modules - Boston right now, this vacancy will be placed in Massachusetts. More details about this vacancy opportunity kindly read the description below. Our client is a fast growing maker of MMICs and Modules for high frequency applications; Based in Phoenix, AZ, they engineer ! MMICs and integrate microwave assemblies into Commercial SATCOM, Automotive and Defense Phased Array Radar applications.
They are looking for a Mechanical/Packaging Engineer who will do Packaging Design for RF/Microwave Modules for Defense and Space applications. We are looking for a BS Mechanical Engineering, ideally an MS ME with 8 years or more of experience. The candidate needs to have RF/Microwave Packaging; ideally at higher frequencies.
We need expertise in: MCM On-Laminates, Flip Chip, BGA technologies. Would expect skills in Die Attach, Wire bonding, wedge bonding and some good knowledge of Back End processes.
Tools: Mechanical Tools like SolidEdge, Solidworks or other 3D analysis tools. Thermal Analysis using FEA .
Must be a US citizen.
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If you were eligible to this vacancy, please email us your resume, with salary requirements and a resume to Advanced Technology Search.
If you interested on this vacancy just click on the Apply button, you will be redirected to the official website
This vacancy starts available on: Sat, 15 Jun 2013 10:34:37 GMT
Apply Mechanical/Packaging Engineer; Microwave Modules - Boston Here
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